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Plastic Molding Technologies/Transfer Molding and Compression Molding | TOWA Corporation

2021-11-14  周玉剛

Material cost reduction with 100% resin efficiency
With the compression method, liquid or granular resin is put directly into the cavity and then melted before the workpiece is immersed in it for resin molding. This method makes it unnecessary to use a gate or a runner, which are used for the transfer method, and makes the efficiency in the use of resin almost 100%. The compression method contributes greatly to customer’s cost reduction and reduces the amount of waste, which makes it a more environmentally friendly molding technology than ever before.

No resin flow allowing thinner wires
With molding using the compression method, there is virtually no resin flow, which enables the impact on chips and wires to be minimized. It improves the molding quality of package products and permits the use of thinner wires, leading to the reduction of material costs.

Applicable to large size panels and wafers
For reducing the cost of semiconductor packages, lead frames and substrates sizes are becoming larger, requiring semiconductor manufacturing equipment that is compatible with them.
By using our compression technology, it’s possible to mold ultra large panels and offer solutions for industry cost reduction needs ahead of the market.

Face down method adopted
Due to thinner semiconductor packages, it is necessary to evenly and uniformly supply resin to panels and wafers with large mold area. By adopting the face down method, we have realized uniform and extremely thin molding even for large mold areas. And compared to the face up method, its superiority is recognized with less warpage generated during molding.

Reduced manufacturing process and cleaning-less
This method reduces the time taken for the overall manufacturing process because it does not require the processes after molding such as backgrinding and chemical mechanical polishing (CMP).
In addition, it uses a mold release film, which makes it unnecessary to clean the mold.

Our molding technology based on the compression method also reduces the pressure applied to the workpiece, enabling the molding of products made from low-K materials to be optimized.
Products such as 3D NAND flash memory, application processors, fingerprint sensors, power devices have been showing growth, and the compression method adapted to those devices has been high valued in the global market as an equipment with stable quality and productivity.

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